JPH073638Y2 - ワイヤボンダーにおけるワイヤカット用クランプ装置 - Google Patents

ワイヤボンダーにおけるワイヤカット用クランプ装置

Info

Publication number
JPH073638Y2
JPH073638Y2 JP1989000690U JP69089U JPH073638Y2 JP H073638 Y2 JPH073638 Y2 JP H073638Y2 JP 1989000690 U JP1989000690 U JP 1989000690U JP 69089 U JP69089 U JP 69089U JP H073638 Y2 JPH073638 Y2 JP H073638Y2
Authority
JP
Japan
Prior art keywords
wire
arm member
pad
clamp
spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989000690U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0291344U (en]
Inventor
和幸 船津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1989000690U priority Critical patent/JPH073638Y2/ja
Publication of JPH0291344U publication Critical patent/JPH0291344U/ja
Application granted granted Critical
Publication of JPH073638Y2 publication Critical patent/JPH073638Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1989000690U 1989-01-06 1989-01-06 ワイヤボンダーにおけるワイヤカット用クランプ装置 Expired - Lifetime JPH073638Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989000690U JPH073638Y2 (ja) 1989-01-06 1989-01-06 ワイヤボンダーにおけるワイヤカット用クランプ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989000690U JPH073638Y2 (ja) 1989-01-06 1989-01-06 ワイヤボンダーにおけるワイヤカット用クランプ装置

Publications (2)

Publication Number Publication Date
JPH0291344U JPH0291344U (en]) 1990-07-19
JPH073638Y2 true JPH073638Y2 (ja) 1995-01-30

Family

ID=31199942

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989000690U Expired - Lifetime JPH073638Y2 (ja) 1989-01-06 1989-01-06 ワイヤボンダーにおけるワイヤカット用クランプ装置

Country Status (1)

Country Link
JP (1) JPH073638Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118712122B (zh) * 2024-08-30 2024-12-06 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 热声键合机的联动式断线装置

Also Published As

Publication number Publication date
JPH0291344U (en]) 1990-07-19

Similar Documents

Publication Publication Date Title
US5647528A (en) Bondhead lead clamp apparatus and method
US6047877A (en) Lead penetrating clamping system
EP0297244A3 (en) Single lead automatic clamping and bonding system
JPH073638Y2 (ja) ワイヤボンダーにおけるワイヤカット用クランプ装置
JPH06306691A (ja) めっき用ハンガーのクランパ開閉装置
JPH0219968Y2 (en])
JPH0325403Y2 (en])
JP2765168B2 (ja) ワイヤボンダにおけるキャピラリへのワイヤの挿通方法
JP3652955B2 (ja) プライヤー付きディスクカッター
JPH08115940A (ja) ワイヤボンディング装置におけるワイヤクランプ機構の構造及びクランプ片の固着方法
JP3263462B2 (ja) ワイヤボンディング用ワイヤの把持装置
JPS5988841A (ja) ワイヤボンデイング装置
JPH10121295A (ja) 被表面処理材料の吊下具
JPH06325644A (ja) 線材等の整線作業に使用される張力コントロール装置
JPH05291337A (ja) クランプ機構及びこれを具備したワイヤボンディング装置
JP2000246569A (ja) クランプ装置
JPH0630863B2 (ja) 吸着ノズルの回り留め装置
JPH0793246B2 (ja) 電子部品リード線の成形方法及び装置
JPH04155843A (ja) ワイヤボンディング方法
JPH098077A (ja) ワイヤボンディング装置
JPH0145016B2 (en])
JPH0281752A (ja) 端子取付装置
JPS6364896B2 (en])
JPH0521502A (ja) ワイヤボンデイング装置
JPS627652U (en])

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term